1. Plating solution micro-circulation system: Built-in two sets of porous foam
tubes and quiet air pump to make plating solution micro-circulation to improve
the quality of plating;
2. Plating PCB moves towards and backwards regularly: Control electroplating
speed can be adjusted.
3. Integrated structure
4. sealed design ensure no plating solution pollution, plating quality is good.
5. Power supply: adjustable DC stable power supply and pressure can provide
0-15V, 0-5A of constant voltage and constant current.